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A Cortex-M Microcontroller-Enabled Electronic Timer: A Radio Shack Remix

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{NAME} Catch up on the latest news, technical articles, and more from All About Circuits this week.

{NAME} Catch up on the latest news, technical articles, and more from All About Circuits this week. [View this email in your browser]( Weekly Update September 20. 2024 [NEWS]( [NI Unveils Bus-Powered USB DAQ Device That Revs Up Measurement Performance]( By [Jake Hertz]( Announced today, the new DAQ blends high-performance data capture with robust software support. [Infineon Makes First 300mm Power GaN Wafer With Existing Manufacturing Tools]( By [Mike Falter]( The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon. [Remembering John B. Goodenough, Inventor of the Lithium-Ion Battery]( By [Duane Benson]( Dr. Goodenough received a Nobel Prize at the age of 97 for his contributions to making the Lithium-ion battery a reality. [Allegro Unveils Current Sensors Boasting ‘Superior Magnetic Sensitivity’]( By [Jake Hertz]( The new sensors leverage tunnel magnetoresistance sensing to sharpen sensitivity and precision. CONTENT FROM PARTNERS [AQ27COM-01 Bidirectional TVS Diode]( Sponsored by [Mouser Electronics]( Littelfuse AQ27COM-01 Bidirectional TVS Diode provides a high Electrostatic Discharge (ESD) protection level for electronic equipment. [Omron G2RL Power PCB Relays]( Sponsored by [DigiKey]( Featuring a sleek, low-profile design available in various configurations, including single & double pole and high-sensitivity coil types. [Renesas' Broad Power Portfolio Includes GaN Devices and Technology]( Sponsored by [Renesas]( Renesas’ discrete portfolio of IGBTs, SiC and Si Power FETs, now combined with GaN devices, offers customers maximum flexibility for system design. [Understanding IPC Class 2 vs Class 3 Solder Joints]( Sponsored by [Samtec]( What is the difference between IPC-A-610 Class 2 and Class 3 solder joints?  This article focuses on J-Lead solder joints. [400 V CoolSiC MOSFET Gen2 | Answering the Questions - Why and Where To Use?]( Sponsored by [Infineon Technologies]( Discover the design flexibility and performance of the new 400 V CoolSiC™ MOSFET in power conversion, target applications, and topologies. [Powering AI from 48 V to Core]( Sponsored by [Infineon Technologies]( Learn about AI's power demands, Infineon’s power solutions, DC-DC conversion, and optimizing power delivery in AI data centers for higher efficiency. [TECHNICAL ARTICLES]( [A Cortex-M Microcontroller-Enabled Electronic Timer: A Radio Shack Remix]( By [Don Wilcher]( In this Radio Shack Classic Circuits Remix, we add modern microcontroller functionality to the vintage Electronic Timer project for the Science Fair 65-in-1 kit. [How to Hurdle Overswing and Noise In Low Power Designs]( By [Burkhard Laue, Nexperia]( Overswing can occur when Zener diodes are pushed to their limits. Learn about why this happens and the problems it causes—and how to overcome the issue. [Understanding the Transformer-Coupled Voltage-Switching Class D Amplifier]( By [Dr. Steve Arar]( In this article, we'll learn how the transformer-coupled voltage-switching Class D amplifier works and highlight some of its advantages. [The Relationship Between Rise Time and Bandwidth in Digital Signals]( By [Dr. Steve Arar]( In this article, we’ll look at the relationship between the rise/fall time of a digital signal and its bandwidth. [INDUSTRY WEBINARS]( [Navigating Overvoltage Protection: TVS Diodes, MOVs, and Polymer ESD Varistors]( In partnership with [Eaton Electronics]( This presentation covers overvoltage protection components like TVS diodes and MOVs, explaining their applications and how to choose the right ones. [Solve Common MCU Design Challenges with MSPM0 MCU Subsystems]( In partnership with [Texas Instruments]( Simplify software development using TI’s MSPM0 MCU subsystems, integrating application building blocks tailored to your specific design needs. [Lifting the Fog: An Introduction to EU Cyber Security Regulations]( In partnership with [Congatec]( Learn about the Cyber Resilience Act, NIS2 directive, and IEC 62443, and how they can guide your journey towards EU cyber security compliance. [Riding the Second Wave of SiC: Power Packaging]( In partnership with [DigiKey]( Get an overview of Silicon Carbide (SiC) advancements in packaging technology, enabling higher SiC die performance in power applications. [Streamline Development with MCX MCUs, Expansion Boards & Application Code Hub]( In partnership with [NXP USA, Inc.]( Explore NXP’s low-cost development boards and software solutions that simplify and speed up the developer process across different design stages. [Revolutionizing High Voltage Power: Unveiling the 600 V CoolMOS™ 8 SJ MOSFET]( Sponsored by [Infineon Technologies]( Explore the 600 V CoolMOS™ 8 SJ MOSFET series, its applications, and its impact on high-voltage super-junction technology in this webinar. [LATEST FORUM THREADS]( [Using MOSFET to Convert PWM- to PWM+ (and Failing)]( Replies: 9 / Views: 47 [Stepping Up the Current]( Replies: 2 / Views: 40 [Shouldn't Op-Amp Feedback Be Physically Impossible?]( Replies: 54 / Views: 465 [Choose Sensor for Car Distributor]( Replies: 26 / Views: 345 [Need Help Figuring Out a 1990 DELCO GM Radio Schematic]( Replies: 14 / Views: 96 [Capacitor Continuity Question]( Replies: 8 / Views: 102 [Wiring Diagram for a Motorized Zoom Lens]( Replies: 23 / Views: 191 [Building an AVR for Small Generator]( Replies: 0 / Views: 22 [Facebook icon]( [Twitter icon]( [LinkedIn icon]( [YouTube icon]( [Instagram icon]( [Website icon]( Copyright (C) 2024 EETech Media. All rights reserved. Registered member of AllAboutCircuits.com Want to change how you receive these emails? You can [update your preferences or]( from this list](

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